Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure

Synchrotron X-ray analysis of the Sn electromigration behavior and whisker growth in a Blech structure using nano-X-ray fluorescence microscopy white beam Laue nanodiffraction was conducted. depletion at cathode whisker/extrusion formation anode were characterized in-situ, results obeyed kinetics. This scenario gradually decayed because counterbalance between electron wind force back stress. White showed that noticeable compressive deviatoric stress direction flow built up strips, particularly roots whiskers, confirming electromigration-induced atomic accumulation occurred downstream strip whiskering closely related to internal resulting from confined segments. Finally, theoretical model based on fundamental theory revealed diffused predominately through lattice grain boundary paths homologous temperature 0.6.